SEMICON Southeast Asia 2026: Connecting with the region’s semiconductor community

SEMICON Southeast Asia 2026 brought the industry together once again in Kuala Lumpur. Together with Trymax Semiconductor, NexGen exhibited under the Singapore Pavilion, meeting customers, partners, and industry professionals from across the region.

SEMICON China 2026: Connecting with the semiconductor community in Shanghai

SEMICON China 2026 brought together leading companies and industry experts from across the global semiconductor ecosystem. Together with Trymax Semiconductor, NexGen presented its solutions under the Singapore Pavilion and connected with customers, partners, and industry professionals from across the region.

SEMICON Japan 2025: Strengthening our presence in Japan

SEMICON Japan 2025 brought the semiconductor community together in Tokyo. For NexGen, the event was a valuable opportunity to connect with customers, partners, and industry professionals and strengthen our presence in one of the world’s most important semiconductor markets.

SEMICON Europa 2025: Connecting with the European Semiconductor Community

SEMICON Europa 2025 brought together the semiconductor industry in Munich — and NexGen was right in the middle of it. Together with Trymax Semiconductor, we connected with customers, partners, and industry experts and shared our latest solutions for semiconductor manufacturing.

SEMICON Southeast Asia 2025: A Strong Presence in Singapore

SEMICON Europa 2025 brought together the semiconductor industry in Munich — and NexGen was right in the middle of it. Together with Trymax Semiconductor, we connected with customers, partners, and industry experts and shared our latest solutions for semiconductor manufacturing.

NexGen Showcases Integrated Metrology Innovation at SEMICON SEA 2025

At SEMICON SEA 2025, NexGen Wafer Systems will showcase its latest breakthroughs in ultra-precise wet etching with integrated metrology. Don’t miss our tech stage talk on May 22 and visit us at Booth #B1633 to experience live insights and meet our partners from Trymax. Discover the future of process control—right here in Singapore!

NexGen at CMP & WET Users Meeting 2025

Our CTO Dr. Martin Huber presented on improving TTV in thinned wafers at this year’s CMP & WET Users Meeting in Leuven, hosted at imec.

NexGen Showcases Integrated Metrology Innovation at SEMICON SEA 2025

At SEMICON SEA 2025, NexGen Wafer Systems will showcase its latest breakthroughs in ultra-precise wet etching with integrated metrology. Don’t miss our tech stage talk on May 22 and visit us at Booth #B1633 to experience live insights and meet our partners from Trymax. Discover the future of process control—right here in Singapore!

NexGen Expands Presence in Japan Through Partnership with Kanematsu PWS Ltd

Press Release – For Valued Use by Media Representatives.

NexGen Wafer Systems Now Offers Apprenticeships in Villach!

Kick-start your career in mechatronics! NexGen Wafer Systems now offers apprenticeships in Villach, providing hands-on training with cutting-edge technology.

Thank You for Making Semicon Europa 2024 a Success!

From November 12th to 15th, Semicon Europa once again took place in Munich, and NexGen was proud to be part of this premier event.

NexGen Wafer Systems Introduces SERENO, a versatile, high-throughput Wet Etch and Clean Solution with Integrated Metrology for 6”, 8” and 12” Substrates

NOV 6, 2024 /// NexGen Wafer Systems today announced the launch of SERENO, a versatile, high-throughput multi-chamber platform designed for wet etch and clean processes. The new system offers integrated metrology and supports 6″, 8″, and 12″ wafers, meeting the semiconductor industry’s need for precision and efficiency.

NexGen was Co-Host of the European CMP & WET Users Group Meeting

The event provided a platform for high-level discussions, insights into the latest developments, and intensive professional exchange. Representatives from various companies and research institutions shared their knowledge and experiences on the topics of Chemical and Mechanical Polishing (CMP) and wet chemical processing of semiconductor wafers (WET).

Doping-selective etching of silicon for wafer thinning in the fabrication of backside-illuminated stacked CMOS image sensors

Backside thinning, using silicon doping-selective etching, for the preparation of backside illuminated (BSI) CMOS sensors. Tailored HNA chemistry (HF: HNO3: CH3COOH) is used to stop at a dedicated p+/p- silicon transition layer with high p+/p- selectivity, providing sub‑micron total thickness variation.

Introduction to SECS/GEM

Meet Iwin Lee, Software Lead at NexGen Wafer Systems, as he shares insights into SECS/GEM and GEM300, the gold standard communication protocols in semiconductor manufacturing. Discover how these standards streamline fab operations and how NexGen ensures compliance for seamless equipment integration and enhanced automation solutions.

About NexGen Wafer Systems /// General Company Presentation

General Press Information – For Valued Use by Media Representatives.