Christian Kleindienst (NexGen Wafer Systems), Judith Schön (Gesundheits-und Thermenresort Warmbad-Villach), Barbara Lagger (Gesundheits-und Thermenresort Warmbad-Villach), Gerfried Zwicker (Zwickerconsult), Benjamin Steible (Fraunhofer ISIT), Knut Gottfried (ErzM-Technologies UG & Fraunhofer ENAS), Martin Kulawski (Advaplan Oy)

Over 120 Participants at the European CMP & WET Users Group Meeting

The European CMP & WET Users Group Meeting took place on April 18 and 19, 2024, with great success at the renowned Hotel Warmbaderhof***** in Villach. More than 120 participants from the semiconductor industry gathered to attend this significant industry meeting.

The event provided a platform for high-level discussions, insights into the latest developments, and intensive professional exchange. Representatives from various companies and research institutions shared their knowledge and experiences on the topics of Chemical and Mechanical Polishing (CMP) and wet chemical processing of semiconductor wafers (WET).

The participants expressed great satisfaction with the course of the meeting, particularly highlighting the quality of the discussions and the networking opportunities. The European CMP & WET Users Group Meeting at Warmbaderhof was thus a complete success and reinforced Villach’s position as a European hotspot for the semiconductor industry.

The organization of this significant industry meeting was handled this year by the Villach-based company NexGen Wafer Systems GmbH, which manufactures wet chemistry equipment for chip producers.

For more information about the European CMP & WET Users Group Meeting, please visit the official website:

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