The European CMP and WET Users Group Meeting 2025 took place this year in Leuven, Belgium, from April 10 to April 11. The event was hosted at imec, one of Europe’s largest and most prestigious R&D centers.
Following last year’s edition — which was co-organized by NexGen Wafer Systems and held in Villach, Austria — we were once again proud to participate in this important industry gathering.
This year, our CTO Dr. Martin Huber contributed to the technical program with a presentation titled:
“Method to Improve the Total Thickness Variation of Thinned Substrate Wafers.”
This presentation did focus on one of the key challenges in advanced wafer processing: minimizing Total Thickness Variation (TTV) after substrate thinning. This critical parameter directly impacts device performance and overall yield. NexGen Wafer Systems machine learning based appraoch is employing strategies to monitor and control the TTV in real time – based on our integrated metrology solutions and smart process control.
We are pleased to have been part of such a focused and forward-thinking user group once again. Events like this are invaluable for fostering technical exchange, sharing best practices, and advancing innovation across the semiconductor ecosystem.
We thank Knut Gottfried, Imme Ellebrecht, and the entire organizing committee for putting together such an outstanding event. We look forward to contributing again next year.
